Sensor Mold Tool

For this project we equipped an existing mold with several different sensors. These are temperature, pressure, dielectric sensors and optical sensors for strain to collect data during the compression molding process.

The sensors are placed at different positions in the mold to monitor the compound behaviour during the molding process.

 Compression molding is a process in which a heated (100-200 °C) thermoset compound is pressed over a substrate with microelectronics chips as a protective layer.

 The sensor data is used for further development of the mold process as well as the compound.

 In addition to the mechanical adjustments of the mold we made a rack for all sensor equipment. Also we developed a transport trolley suitable for this mold including the sensors.

 This project was commissioned by Fraunhofer IZM in Berlin.

 Project properties

• Engineering of the integration of various sensors in the existing mold.
• Mechanical adjustments of the hardened steel mold parts.
• Installation and testing of the mold including signal readout of the sensors.
• Integration of all data from each sensor in a software tool.